Published on : Feb 19, 2018
Albany, New York, February 19, 2018: In recent times, semiconductor packaging has evolved rapidly, giving rise to advanced semiconductor packaging technologies. Several manufacturers are moving towards new packaging options such as 2.5D integrated circuits and 3D integrated circuits. Due to these movement, the global market for advanced semiconductor packaging has been gaining steady impetus. To explore further, Market Research Hub (MRH) has publicized a new study titled to its mega-repository, which is titled as “Advanced Semiconductor Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 – 2026”. This study accurately predicts the future of the market and also gives an impression of the present market situation. It is a result of dynamic research compiled by a team of expert analysts who have done the needful data crunching and study of market drivers and restraints for every sector of the market.
For the benefit of the readers, the report provides a complete perspective on the market’s growth on the basis of revenue in US$ Mn, covering different geographical regions namely Europe, Japan, Asia Pacific excluding Japan, North America, Middle East & Africa and Latin America. Looking to the global market scenario, analyst anticipate that the market for advanced semiconductor packaging is likely to bring in US$ 67,208.2 million revenue towards 2026 end. At this pace, the market is expected to witness strong growth, registering a CAGR of 10.9% during 2017-2026.
In terms of geographical presence, Asia Pacific Excluding Japan (APEJ) is likely to dominate the global advanced semiconductor packaging market from 2017 to 2026. Presence of the major market players in this particular region is one of the factors driving the market growth.
Apart from the geographical segregation, the research further broadly categorizes the market data on the basis of packaging type, application and end user. End Users are further segmented into consumer electronics, medical devices, aerospace and defense, automotive, telecommunications, and other end users. Among these, consumer electronics are expected to be the largest users of advanced semiconductor packaging during the forecast period. Also, increasing demand for automation in vehicles is ensuing in the need for semiconductor devices of small size, thus driving the demand for advanced semiconductor packaging solution in the automotive sector.
Major applications for which advanced semiconductor packaging method are used include processor/ baseband, central processing units/graphical processing units, dynamic random access memory, NAND and image sensor. On the other hand, packaging type segmentation includes 2.5D/3D, Flip Chip (FC), Fan-In Wafer-Level Packaging (FI WLP), and Fan-Out Wafer-Level Packaging (FO WLP).
At the end, the research provides vital information about the key players operating in the sector, such as Intel Corp, Sumitomo Chemical Co. Ltd., Amkor Technology, Kyocera, AMD, Hitachi Chemical, STMicroelectronics, Avery Dennison, Infineon, and ASE Group.
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