Global Die-Attach Materials Market Highlights Sluggish Growth at 3.1% CAGR during 2017 – 2026


Published on : Jan 22, 2018

Albany, New York, January 22, 2018: Over the years, the developing semiconductor industry has worked to create new paths for the use of electronic components across a wide range of devices. It has been analyzed that, the increasing use of electronic chips as well as chipsets has motivated the demand for die-attach materials. Hence, in order to understand the market scenario for die-attach materials, a new research report has been added to the wide database of Market Research Hub (MRH). This intelligent study is titled “Die-Attach Materials Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 – 2026”, which discourses market trends, forecasts as well as market size estimations for the period until 2026. Each section of the report serves a specific purpose in order to give a complete dissection about the global market for die-attach materials.

As per active research findings, close to US$ 970 Mn revenue would be gathered through the sales of die-attach materials by the end of 2026. However, the demand for die-attach materials is likely to incur limits from production complications, procurement challenges linked to raw materials and swelling technical expectations. In addition, the global die-attach materials market is fixed to expand at a lethargic CAGR of 3.1%.

This research report starts with the economic outlook followed by market overview. The readers can access knowledge about market definition, market size & forecast, during 2012-2026. Further, market dynamics and worldwide Semiconductor Billing (USD in millions) are also part of this segment. It is important to note that, the report evaluates the global die-attach materials market on the basis of material, form and product type. Hence, based on product-type, the report mentions that films created out of die-attach materials would be widely used across semiconductors business worldwide. Also, the effectiveness of die-attach solder products considering their electrical conductivity is expected to motivate their demand in the global market. 

Looking at the geographical expanse, the markets across North America, Latin America, Europe, Japan, APEJ and MEA are carefully assessed in this report. Each of these regions has been analyzed on the basis of revenue comparison and market size. The final section of the report drops light on the major players from the global die-attach materials market. Dow Corning Corporation, Hybond Inc., Alpha Assembly Solutions, Henkel, Master Bond Inc., AI Technology and Creative Materials Inc., are some of the leading manufacturers striding their way to achieve expansion goals during the forecast period (2017-2026).

Request a Sample with TOC in a PDF format : https://www.marketresearchhub.com/enquiry.php?type=S&repid=1486373

About Market Research Hub

Market Research Hub (MRH) is a next-generation reseller of research reports and analysis. MRH’s expansive collection of market research reports has been carefully curated to help key personnel and decision makers across industry verticals to clearly visualize their operating environment and take strategic steps.

MRH functions as an integrated platform for the following products and services: Objective and sound market forecasts, qualitative and quantitative analysis, incisive insight into defining industry trends, and market share estimates. Our reputation lies in delivering value and world-class capabilities to our clients.

Research Assistance

For Enquiries, Call :

+1-800-998-4852US Toll Free

Email : sales@marketresearchhub.com

Back To Top