Global ESD Foam Packaging Market to Exhibit a CAGR of 6.3% Through 2022

Published on : Nov 03, 2017

Albany, New York, November 3, 2017: According to a latest study titled “ESD Foam Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 – 2022” added into the repository of “Market Research Hub (MRH)”, the global ESD foam packaging market is estimated to deliver a growing value of US$233.8 mn by the end of 2022 from its valuation worth US$172.5 mn calculated in 2017. The report also projects that the global ESD foam packaging market is expected to grow at a 6.3% CAGR during the forecast period from 2017 to 2022.

ESD stands for electrostatic discharge which are a plastics that helps in reducing static electricity to protect electrostatic sensitive devices, components or assemblies. Nowadays, ESD foam packaging is widely used for shipping of electronic components and devices. The market for ESD foam packaging is witnessing a substantial growth owing to the high demand for small and lightweight electronic devices which in turn leads to reduction of sizes of semiconductor integrated circuits mainly in the automotive and telecommunication industries.

While sharing key insights into the market of ESD foam packaging, the report states that the global ESD foam packaging market is envisioned to drive its growth on lasting trends such as the development of smart cities wherein multitudinous IT solutions can be integrated.

On application basis, the global ESD foam packaging market is segregated into two segments which are electrical and electronic component and others. Out of these, the electrical and electronic component segment is estimated to hold a larger share of 93.1%. On the basis of material and additive, the ESD foam packaging market is divided into metal, additive AND conductive & dissipative polymer. In terms of end-use industry, the global market for ESD foam packaging can be classified into automobile, electrical and electronics, aerospace, manufacturing, defense and military and others. Geographically, the global ESD foam packaging market is predicted to be segmented into key regions and countries. As per the report, the APEJ (Asia Pacific except Japan) region is expected to lead the market in terms of share in the forecast period with a CAGR of 5.8%. It further says that regions such as North America and Europe could offer tremendous growth opportunities to players in ESD foam packaging market.

The report lists and profiles some of the key players in global ESD foam packaging market which are GWP Group Limited, Statclean Technology (S) Pte Ltd., Electrotek Static Controls Pvt. Ltd., Helios Packaging, Botron Company, Inc., Elcom U.K. Ltd., Tekins Limited, Conductive Containers and Nefab AB.

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