Global Semiconductor Packaging Materials Market 2017-2021

Global Semiconductor Packaging Materials Market 2017-2021

Nov 2017 Technavio Packaging136 Pages Price :
$ 3500
About Semiconductor Packaging Materials
Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

Technavios analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
Amkor Technology
DuPont
Henkel
Honeywell
Kyocera
Toppan Printing
Other prominent vendors
Hitachi Chemical
ASM Pacific Technology
BASF
Beijing Kehua New Chemical Technology
Market driver
Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
For a full, detailed list, view our report

Market challenge
Capital-intensive market
For a full, detailed list, view our report

Market trend
Increase in adoption of flip-chip, Sip, lead-free packaging solutions
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?


You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.



Table of Contents
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: INTRODUCTION
Market outline
PART 05: MARKET LANDSCAPE
Market ecosystem
Market characteristics
Market segmentation analysis
PART 06: MARKET SIZING
Market definition
Market sizing 2016
Market size and forecast 2016-2021
PART 07: FIVE FORCES ANALYSIS
Bargaining power of buyers
Bargaining power of suppliers
Threat of new entrants
Threat of substitutes
Threat of rivalry
Market condition
PART 08: CUSTOMER LANDSCAPE
PART 09: MARKET SEGMENTATION BY MATERIAL TYPE
Segmentation by material type
Organic substrates Market size and forecast 2016-2021
Lead frames Market size and forecast 2016-2021
Bonding wires Market size and forecast 2016-2021
Others Market size and forecast 2016-2021
Market opportunity by type of materials
PART 10: REGIONAL LANDSCAPE
Geographical segmentation
APAC Market size and forecast 2016-2021
Americas Market size and forecast 2016-2021
EMEA Market size and forecast 2016-2021
Market opportunity
PART 11: DECISION FRAMEWORK
PART 12: DRIVERS AND CHALLENGES
Market drivers
Market challenges
PART 13: MARKET TRENDS
Increase in adoption of flip-chip, Sip, lead-free packaging solutions
Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging
Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material
PART 14: VENDOR LANDSCAPE
Competitive scenario
PART 15: VENDOR ANALYSIS
Vendors covered
Vendor classification
Market positioning of vendors
Amkor Technology
DuPont
Henkel
Honeywell
Kyocera
Toppan Printing
PART 16: APPENDIX
List of abbreviations
List of Exhibits
Exhibit 01: Steps in back-end chip formation
Exhibit 02: Roadmap of semiconductor packaging
Exhibit 03: Old supply chain of semiconductor IC packaging industry
Exhibit 04: New supply chain of semiconductor IC packaging industry
Exhibit 05: Related market
Exhibit 06: Semiconductor packaging materials technologies
Exhibit 07: Global semiconductor packaging materials market overview
Exhibit 08: Market characteristics
Exhibit 09: Market segments
Exhibit 10: Market definition - Inclusions and exclusions checklist
Exhibit 11: Market size 2016
Exhibit 12: Validation techniques employed for market sizing 2016
Exhibit 13: Global semiconductor packaging materials Market size and forecast 2016-2021 ($ billions)
Exhibit 14: Global semiconductor packaging materials market Year-over-year growth 2017-2021 (%)
Exhibit 15: Five forces analysis 2016
Exhibit 16: Five forces analysis 2021
Exhibit 17: Bargaining power of buyers
Exhibit 18: Bargaining power of suppliers
Exhibit 19: Threat of new entrants
Exhibit 20: Threat of substitutes
Exhibit 21: Threat of rivalry
Exhibit 22: Market condition in 2016 - Five forces
Exhibit 23: Customer landscape
Exhibit 24: Global semiconductor packaging materials by market type 2016-2021 (%)
Exhibit 25: Comparison by end-user
Exhibit 26: Organic substrates Market size and forecast 2016-2021 ($ billions)
Exhibit 27: Organic substrates Year-over-year growth 2017-2021 (%)
Exhibit 28: Lead frames Market size and forecast 2016-2021 ($ billions)
Exhibit 29: Lead frames Year-over-year growth 2017-2021 (%)
Exhibit 30: Bonding wires Market size and forecast 2016-2021 ($ billions)
Exhibit 31: Bonding wires Year over year growth 2017-2021 (%)
Exhibit 32: Others Market size and forecast 2016-2021 ($ billions)
Exhibit 33: Others Year-over-year growth 2017-2021 (%)
Exhibit 34: Market opportunity by material type
Exhibit 35: Global semiconductor packaging materials market share by geography 2016-2021 (%)
Exhibit 36: Regional comparison
Exhibit 37: APAC Market size and forecast 2016-2021 ($ billions)
Exhibit 38: APAC Year-over-year growth 2017-2021 (%)
Exhibit 39: Top 3 countries in Americas
Exhibit 40: Americas Market size and forecast 2016-2021 ($ billions)
Exhibit 41: Americas Year-over-year growth 2017-2021 (%)
Exhibit 42: Top 3 countries in EMEA
Exhibit 43: EMEA Market size and forecast 2016-2021 ($ billions)
Exhibit 44: EMEA Year-over-year growth 2017-2021 (%)
Exhibit 45: Top 3 countries in APAC
Exhibit 46: Vendor classification
Exhibit 47: Market positioning of vendors
Exhibit 48: Amkor Technology overview
Exhibit 49: Amkor Technology Business segments
Exhibit 50: Amkor Technology Organizational developments
Exhibit 51: Amkor Technology Geographic focus
Exhibit 52: Amkor Technology Business segment focus
Exhibit 53: Amkor Technology Key application packaging products
Exhibit 54: DuPont overview
Exhibit 55: DuPont Business segments
Exhibit 56: Dupont Organizational developments
Exhibit 57: Dupont Geographic focus
Exhibit 58: Dupont Segment focus
Exhibit 59: Dupont Key offerings
Exhibit 60: Henkel overview
Exhibit 61: Henkel Business segments
Exhibit 62: Henkel Organizational developments
Exhibit 63: Henkel Geographic focus
Exhibit 64: Henkel Segment focus
Exhibit 65: Henkel Key offerings
Exhibit 66: Honeywell overview
Exhibit 67: Honeywell Business segments
Exhibit 68: Honeywell Organizational developments
Exhibit 69: Honeywell Geographic focus
Exhibit 70: Honeywell Segment focus
Exhibit 71: Honeywell Key offerings
Exhibit 72: Kyocera overview
Exhibit 73: Kyocera Business segments
Exhibit 74: Kyocera Organizational developments
Exhibit 75: Kyocera Geographic focus
Exhibit 76: Kyocera Segment focus
Exhibit 77: Kyocera Key offerings
Exhibit 78: Toppan Printing overview
Exhibit 79: Toppan Printing Business segments
Exhibit 80: Toppan Printing Organizational developments
Exhibit 81: Toppan Printing Geographic focus
Exhibit 82: Toppan Printing Segment focus
Exhibit 83: Toppan Printing Key offerings

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