Report on the Chinese PCB Industry 2019

Report on the Chinese PCB Industry 2019

Aug 2019 ASKCI Consulting Co., Ltd. ICT265 Pages Price :
$ 5000

PCBs refer to connective circuits and components that are printed onto insulative boards. All modern electronics devices whether it be computers, mobile phones, consumer electronics or electronic toys all use PCBs to a certain extent.

The upstream portion of the PCB industry supply chain deals with base materials including copper laminates, copper foil, copper anodes, prepregs, dry membranes and silver halide. The downstream portion covers computers, communications devices, national defense, industry and medical electronics industries. As the PCB industry’s production model is an order-based one, it is common for downstream clients to demand shorter delivery times whenever possible, leading to a closer-knit relationship between upstream manufacturers and downstream clients. 

Global PCB output value reached a total of XX billion USD in 2018, a XX% increase over the previous year. Chinese PCB output value reached a total of XX billion USD in 2018, XX% increase over the previous year.

There are a total of XX PCB manufacturers listed in China as of 2018. The Chinese PCB manufacturing industry reached a total of XX billion CNY in 2018, a XX% growth over the previous year. 

The driving force of growth in the industry largely stems from downstream demand, and as the consumer electronics industry continues to see large increases in demand, the need for technological innovation and greater production figures will likely increase at a steady rate.

Table of Content

CHAPTER 1 PCB MANUFACTURING INDUSTRY OVERVIEW

1.1 PCB manufacturing industry overview
1.1.1 PCB introduction
1.1.2 Basic components
1.1.3 Product categories
1.1.4 Manufacturing process
1.2 Industry chain
1.3 Industry chain upstream analysis
1.3.1 Glass yarn market analysis
1.3.1.1 Glass yarn market supply
1.3.1.2 Glass yarn manufacturing distribution analysis
1.3.1.3 Pricing factors
1.3.2 EP market analysis
1.3.2.1 EP overview
1.3.2.2 EP production overview
1.3.2.3 EP consumption
1.3.3 Copper foil market analysis
1.3.3.1 Market supply analysis
1.3.3.2 Market demand analysis
1.3.3.3 Industry development characteristics
1.3.4 Copper clad laminate market
1.3.4.1 Market development overview
1.3.4.2 Material costs analysis
1.3.4.3 Industry development details
1.3.4.4 Industry development tactics
1.4 Industry chain downstream analysis
1.4.1 Consumer electronics
1.4.2 Computers
1.4.3 Communications devices
1.4.4 Industrial controls and medical devices
1.4.5 Vehicle electronics
1.4.6 National defense and aerospace engineering

CHAPTER 2 INTERNATIONAL PCB MARKET DEVELOPMENTS

2.1 Industry development
2.1.1 PCB manufacturing developments
2.1.2 Industry scale
2.1.3 PCB segment scale
2.1.3.1 Single/double sided board market scale
2.1.3.2 Multi-layered board market scale
2.1.3.3 HDI market scale
2.1.3.4 Packaging substrate market scale
2.1.3.5 Flexible circuit board market
2.1.4 International PCB industry competitive scale analysis
2.1.4.1 Industry competitiveness
2.1.4.2 Manufacturing structure changes
2.1.4.3 Applications
2.2 International PCB companies in China
2.2.1 AT&S
2.2.1.1 Overview
2.2.1.2 Product applications
2.2.1.3. Operational overview
2.2.1.4 Investments in China
2.2.2 Multek
2.2.2.1 Overview
2.2.2.2 Product applications
2.2.2.3 Investments in China
2.2.3 VIASYSTEMS
2.2.3.1 Overview
2.2.3.2 Product applications
2.2.3.3 Operational overview
2.2.3.4 Investments in China
2.2.4 Sanmina-SCI corporation
2.2.4.1 Overview
2.2.4.2 Product applications
2.2.4.3 Operational overview
2.2.4.4 Investments in China
2.2.5 CMK
2.2.5.1 Overview
2.2.5.2 Product applications
2.2.5.3 Operational overview
2.2.5.4 Investments in China
2.2.6 Daeduck GDS
2.2.6.1 Overview
2.2.6.2 Product applications
2.2.6.3 Operational overview
2.2.6.4 Investments in China
2.2.7 Meiko Electronics
2.2.7.1 Overview
2.2.7.2 Product applications
2.2.7.3 Operational overview
2.2.7.4 Investments in China
2.2.8 Hannstar Board Corporation
2.2.8.1 Overview
2.2.8.2 Product applications
2.2.8.3 Operational overview
2.2.8.4 Chinese market investments
2.2.9 Unimicron Technology
2.2.9.1 Overview
2.2.9.2 Product applications
2.2.9.3 Operational overview
2.2.9.4 Investments in China

CHAPTER 3 CHINESE PCB INDUSTRY DEVELOPMENTS

3.1 Industry policies
3.1.1 Governing bodies
3.1.1.1 Governing departments
3.1.1.2 Self-regulation organizations
3.1.2 Industry policies
3.1.2.1 Related policies
3.1.2.2 <12th five-year plan on the IT manufacturing industry>
3.1.2.3 <12th five-year plan on base and key electronics components>
3.1.2.4 
3.1.2.5 
3.1.3 Industry standardization analysis
3.2 PCB industry developments
3.2.1 Development overview
3.2.2 product lifecycle
3.2.3 Market demand
3.2.4 Product structure analysis
3.3 Chinese PCB market scale
3.3.1 Industry output sale
3.3.2 Operational overview
3.3.2.1 Main companies’ operational analysis
3.3.2.2 Operational data from public companies and companies in the process of going public
3.3.2.3 2013 Supply chain advantages
3.3.2.4 Profitability analysis
3.4 SWOT analysis
3.4.1 Strengths
3.4.2 Weaknesses
3.4.3 Opportunities
3.4.4 Threats
3.5 Market competitiveness
3.5.1 Porter’s Five forces
3.5.1.1 Competition between companies
3.5.1.2 Threat of new entrants
3.5.1.3 Threat of replacements
3.5.1.4 Supplier bargaining power
3.5.1.5 Consumer bargaining power
3.5.2 Industry concentration rate
3.5.2.1 Industry concentration
3.5.2.2 Regional concentration
3.5.2.3 Market concentration

CHAPTER 4 CHINESE PCB INDUSTRY OPERATIONAL ECONOMICS ANALYSIS

4.1 Development analysis
4.1.1 2012 developments
4.1.2 2013 developments
4.1.3 2014 developments
4.2 Industry economics
4.2.1 PCB manufacturers
4.2.2 Finances
4.2.3 Sales income
4.2.4 Profits
4.3 Industry costs
4.3.1 Sales costs
4.3.2 Sales expenditure
4.3.3 Industry management costs
4.4 Operational efficiency analysis
4.4.1 Profitability
4.4.2 Gross margins
4.4.3 Debt repayment capabilities

CHAPTER 5 PCB MARKET SEGMENTS

5.1 Segment developments
5.1.1 Segment structure
5.1.2 Segment characteristics
5.1.2.1 PCB mold industry
5.1.2.2 Small batch PCB industry
5.1.2.3 Large batch PCB industry
5.2 Main segment products
5.2.1 FPCs
5.2.1.1 Overview
5.2.1.2 Characteristics
5.2.1.3 Product categories
5.2.1.4 Output value
5.2.1.5 Main applications
5.2.2 HDI
5.2.2.1 Overview
5.2.2.2 Product characteristics
5.2.2.3 Main applications
5.2.2.4 Market prospects
5.2.3 Multi-layer PCBs
5.2.3.1 Overview
5.2.3.2 Main applications
5.2.3.3 Product advantages
5.2.4.1G boards
5.2.4.1 Overview
5.2.4.2 Main applications
5.2.4.3 Strengths and weaknesses
5.2.5 Photovoltaic boards
5.2.5.1 Overview
5.2.5.2 Main applications
5.2.5.3 Strengths and weaknesses
5.2.6 Aluminum substrates
5.2.6.1 Overview
5.2.6.2 Characteristics
5.2.6.3 Main applications

CHAPTER 6 MAIN PCB APPLICATIONS MARKETS

6.1 Downstream application structures
6.2 Mobile phone PCB applications
6.2.1 Global mobile phone production figures
6.2.2 Global smartphone production figures
6.2.3 Chinese smartphone production figures
6.2.4 Chinese mobile phone market price change factors
6.2.5 Phone PCB suppliers
6.2.6 Phone PCB demand analysis
6.3 LCD TV industry PCB applications
6.3.1 Overview
6.3.2 PCB suppliers
6.3.3 PCB demand
6.3.4 PCB demand potential
6.4 Digital camera industry PCB applications
6.4.1 Overview
6.4.2 PCB suppliers
6.4.3 PCB demand
6.4.4 PCB demand projections
6.5 Computer PCB applications
6.5.1 Industry development analysis
6.5.2 Notebook development
6.5.3 Tablet market analysis
6.5.4 PC PCB output value
6.5.5 PCB suppliers
6.5.6 PCB demand analysis
6.5.7 PCB demand potential
6.6 Communication devices industry PCB applications
6.6.1 Overview
6.6.2 PCB characteristics
6.6.3 PCB Suppliers
6.6.4 PCB demand
6.6.5 PCB demand prospects
6.7 Automobile electronics industry PCB applications
6.7.1 Overview
6.7.2 PCB characteristics
6.7.3 Industry scale
6.7.4 Suppliers
6.7.5 Demand analysis

CHAPTER 7 IMPORTS AND EXPORTS ANALYSIS 2014-2018

7.1 Imports and exports data analysis for PCBs with more than 4 layers
7.1.1 Import data analysis
7.1.1.2 Import figures
7.1.1.2 Import finances
7.1.1.3 Import sources
7.1.1.4 Import prices
7.1.2 Export data analysis
7.1.2.1 Export figures
7.1.2.2 Export finances
7.1.2.3 Export recipients
7.1.2.4 Export prices
7.2 Imports and exports data analysis for PCBs with less than 4 layers
7.2.1 Import data
7.2.1.1 Import figures
7.2.1.2 Import finances
7.2.1.3 Import sources
7.2.1.4 Import prices

CHAPTER 8 COMPETITIVENESS ANALYSIS FOR CHINESE PCB KEY REGIONS

8.1 Yangtze River Delta PCB industry competitiveness
8.1.1 Shanghai
8.1.1.1 Development environment
8.1.1.2 Overview
8.1.1.3 Market distribution
8.1.1.4 Demand potential
8.1.2 Jiangsu
8.1.2.1 Development environment
8.1.2.2 Overview
8.1.2.3 Market distribution
8.1.2.4 Demand potential
8.1.3 Zhejiang
8.1.3.1 Development environment
8.1.3.2 Overview
8.1.3.3 Market distribution
8.1.3.4 Demand potential
8.2. Pearl River Delta PCB industry competitiveness
8.2.1 Shenzhen
8.2.1.1 Development environment
8.2.1.2 Overview
8.2.1.3 Advantages
8.2.1.4 Demand potential
8.2.2. Dongguan
8.2.2.1 Development environment
8.2.2.2 Overview
8.2.2.3 Market advantages
8.2.2.4 Demand potential
8.2.3 Huizhou
8.2.3.1 Development environment
8.2.3.2 Overview
8.2.3.3 Market advantages
8.2.3.4 Demand potential
8.3 Jingjin area PCB industry competitiveness
8.3.1 Beijing
8.3.1.1 Development environment
8.3.1.2 Overview
8.3.1.3 Competitiveness analysis
8.3.1.4 Demand potential
8.3.2 Tianjin
8.3.2.1 Development environment
8.3.2.2 Overview
8.3.2.3 Market competitiveness
8.3.2.4 Demand potential

CHAPTER 9 CHINESE PCB INDUSTRY LEADING COMPANIES OVERVIEW

9.1 WUS Printed Circuits
9.1.1 Overview
9.1.2 Financial overview
9.1.3 Economic indicators
9.1.4 Profitability
9.1.5 Debt repayment capability
9.1.6 Corporate operation capability
9.1.7 Corporate costs analysis
9.2 TPC
9.2.1 Overview
9.2.2 Financial overview
9.2.3 Economic indicators
9.2.4 Profitability
9.2.5 Debt repayment capability
9.2.6 Corporate operation capability
9.2.7 Costs analysis
9.3 SYTech
9.3.1 Overview
9.3.2 Financial overview
9.3.3 Economic indicators
9.3.4 Profitability
9.3.5 Debt repayment capabilities
9.3.6 Operational capability
9.3.7 Corporate costs analysis
9.4 Goworld
9.4.1 Overview
9.4.2 Financial overview
9.4.3 Economic indicators
9.4.4 Profitability
9.4.5 Debt repayment capability
9.4.6 Operational capability
9.4.7 Costs analysis
9.5 Chaohua Tech
9.5.1 Overview
9.5.2 Financial overview
9.5.3 Economic indicators
9.5.4 Profitability
9.5.5 Debt repayment capability
9.5.6 Operational capability
9.5.7 Costs analysis
9.6 Danbond
9.6.1 Overview
9.6.2 Financial overview
9.6.3 Economic indicators
9.6.4 Profitability
9.6.5 Debt repayment capability
9.6.6 Corporate operational capabilities
9.6.7 Costs analysis
9.7 CEE PCBs
9.7.1 Overview
9.7.2 Financial overview
9.7.3 Economic indicators
9.7.4 Profitability
9.7.5 Debt repayment capability
9.7.6 Corporate operational capabilities
9.7.7 Costs analysis
9.8 Fastprint Technologies
9.8.1 Overview
9.8.2 Financial overview
9.8.3 Economic indicators
9.8.4 Profitability
9.8.5 Debt repayment capability
9.8.6 Corporate operational capabilities
9.8.7 Costs analysis
9.9 GDM
9.9.1 Overview
9.9.2 Financial overview
9.9.3 Economic indicators
9.9.4 Profitability
9.9.5 Debt repayment capability
9.9.6 Corporate operational capabilities
9.9.7 Costs analysis
9.10 Elling Electronics
9.10.1 Overview
9.10.2 Financial overview
9.10.3 Economic indicators
9.10.4 Profitability
9.10.5 Debt repayment capabilities
9.10.6 Corporate operational capabilities
9.10.7 Costs analysis
9.11 Honghengsheng Electronics
9.11.1 Overview
9.11.2 Main products
9.11.3 Economic indicators
9.11.4 Corporate Operational capabilities
9.11.5 Competitive advantages

CHAPTER 10 CHINESE PCB INDUSTRY DEVELOPMENT PROSPECTS AND INVESTMENT OPPORTUNITIES 2019-2023

10.1 Industry development prospects
10.1.1 Development drive
10.1.2 Development prospects analysis
10.1.3 Industry chain extension
10.2 Development trends
10.2.1 General trends analysis
10.2.2 Consumer electronics PCB industry development trends
10.2.3 Automobile electronics PCB industry development trends
10.3 PCB industry market projected scale

CHAPTER 11 CHINESE PCB INDUSTRY INVESTMENT ENVIRONMENT ANALYSIS

11.1 Investment environment analysis
11.1.1 Macroeconomic environment
11.1.2 13th five-year plan influence on electronics components market
11.2 Investment opportunities and risks
11.2.1 PCB manufacturing industry investment characteristics
11.2.2 PCB industry investment opportunities
11.2.3 Segment markets investment opportunities
11.2.3.1 Consumer electronics
11.2.3.2 Automobile electronics
11.2.3.3 Computers
11.2.4 Investment risks
11.2.4.1 Macroeconomic risks
11.2.4.2 Downstream demand risks
11.2.4.3 Consumer preferences
11.2.4.4 Market competition
11.2.4.5 Material prices
11.2.4.6 Export trade
11.2.4.7 Environment risks
11.3 PCB industry investment strategies
11.3.1 Strategies analysis
11.3.2 Investment channels and selection methods
11.3.2.1 PCB companies’ financing methods and channels
11.3.2.2 Equity financing methods
11.3.2.3 Government leverage
11.3.2.4 Debt financing
11.3.2.5 Private and foreign investment

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